Adesto的EcoXiP支持新的JEDEC标准,为智能设备和边缘处理的新时代铺平道路

Adesto的EcoXiP支持新的JEDEC标准,为智能设备和边缘处理的新时代铺平道路

德国慕尼黑ELECTRONICA–2018年11月13日-为物联网时代提供创新应用专用半导体的领先供应商Adesto Technologies(NASDAQ:IOTS)宣布,它已经推出了第一批支持新技术的串行NOR闪存设备xSPI standard (JESD251 and JESD251-1),Serial Flash Reset Signaling Protocol (JESD252)and the latest version of theSFDP标准(JESD216C).Adesto’s EcoXiP™ eXecute-in-Place (XiP) non-volatile memory (NVM) fully supports these specifications, which were recently released by microelectronics standards body JEDEC. These standards make it easier for system designers to reap the benefits of EcoXiP in their designs and deliver smarter, more efficient and user-friendly devices.

Today, many emerging Internet of Things (IoT) and high-end microcontroller (MCU) designs need more program memory and data processing storage than can be implemented economically on-chip using embedded flash or SRAM. The new standards make it simpler for the industry to adopt NVM devices that use the Octal Serial Peripheral Interface (SPI), such as Adesto’s EcoXiP, which delivers the higher performance and storage space needed. EcoXiP eliminates the need for expensive on-chip embedded flash, and it hits the sweet spot for power, system cost and performance, with significantly lower power consumption compared to other Octal devices and dramatically higher performance versus Quad SPI devices.

“NXP architected crossover processors with no on-board flash and provided an Octal interface to optimize off-chip NVM performance. This allows NXP to deliver a class of microcontrollers that boost processing performance and increase power efficiency at a very competitive price point,” said Joe Yu, GM of Low-Power MPUs at NXP Semiconductors. “Ultimately this helps designers add more features to their products and improve the consumer experience. A low-power external memory device, such as Adesto’s EcoXIP, is a complementary device for our i.MX RT series.”

新的xSPI(expanded SPI)标准建立了硬件指南,使设计人员能够轻松地将高吞吐量的八进制和四进制设备添加到他们的系统中。串行闪存重置信令协议定义了一种无需专用重置引脚就重置闪存设备的方法。SFDP(Serial Flash Discoverable Parameter,串行闪存可发现参数)标准提供了一种一致的方法,在一组通用的内部参数表中描述串行闪存设备的功能和特性。有了它,原始设备制造商可以加快固件开发和上市时间。SFDP规范的最新版本增加了对八进制SPI的支持。

“Adesto提供的解决方案点燃了下一代物联网设备的创新。Adesto的首席技术官Gideon Intrater说:“我们帮助推动这些标准的发展非常重要,我们很高兴成为第一家提供全面支持的串行闪存设备的公司。”。“这是第一次有一套强大的标准来定义串行或闪存通信的方式,使公司能够轻松地集成最新技术并提高其设计的性能。”亚博全网

电子演示

在2018年11月13日至16日举行的Electronica 2018上,Adesto将展示其EcoXiP NVM,该NVM通过八进制xSPI接口与NXP i.MX RT1050交叉处理器集成,符合新标准。参观阿德斯托的展位:慕尼黑展览中心C3馆121号展位。有关更多信息,请联系info@adestotech.com.

关于Adesto Technologies

Adesto Technologies (NASDAQ:IOTS) is a leading provider of innovative application-specific semiconductors for the IoT era. The company’s technology is used by more than 2,000 customers worldwide who are creating differentiated solutions across industrial, consumer, medical and communications markets. With its growing portfolio of high-value technologies, Adesto is helping its customers usher in the era of the Internet of Things.

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