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Fri, 2021-01-08 20:55
#1
旧金山拉莫斯
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Footprint for device DA14585-00000VV2

Hello, I'm looking for your support on getting the recommended footprint for the component DA14585-00000VV2.

I'm interested in knowing your recommendations for such small design BGA packages: Do you recommend Soldermask defined pads or Non-Solder Mask defined Pads, size of the copper pad, size of the mask aperture, routing traces recommendations, etc.

I found the footprint in the SnapEDA site, but it is dowloadable in several ecad formats that I have not access to.

Besides, Not sure if that footprint from an external source, was already validated by your expert tem.

Is it possible to get the recommendded footprint direct from dialog in PDF format with all of your recommendations?

Thanks in advance for your support.

Keywords:
footprint
Device:
DA14585
Mon, 2021-01-11 15:50
PM_Dialog
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Hi Francisco Ramos,

Hi Francisco Ramos,

Thanks for your question and for you interest in our BLE solutions.

I would recommend first checking theAN-B-054: DA14585/586 Application Hardware Design Guidelinesdocument from the DA14585 support website. This document provides all the guideline you need for preparing schematics and PCB layouts for your application using DA14585/DA14586.

You can also check out the schematics and layout from the DA14585 DKs. All the HW collaterals are available online :

//www.xmece.com/products/da14585-development-kit-pro

Thanks, PM_Dialog

Mon, 2021-02-08 23:19
(Reply to #2)
旧金山拉莫斯
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Hello, I already revise the

Hello, I already revise the links provided, but I'm still with a doubt. This particula component, is it aCollapseorNon-Collapsedevice? Could you please respond? Thanks in advance!!

Wed, 2021-02-10 15:22
PM_Dialog
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Hi Francisco Ramos,

Hi Francisco Ramos,

Thanks for your comment. I’ve replied you on the below forum post :

https://support.dialog-semiconductor.com/forums/post/dialog-smartbond-bluetooth-low-energy-%E2%80%93-hardware-device-reference-designs/device-da14585

Thanks, PM_Dialog